Hot spot 1: Domestic LED package reshuffles by IPO
In 2012, with the help of the capital market in the domestic LED packaging industry, the production capacity will be further released, and the competitive pressure will intensify. The first to be eliminated by the last is a small number of small and medium-sized packaging plants with weak technology and market capabilities.
At present, there are 1200-1500 packaging enterprises in China, with more than 40 first camps with annual sales of more than 100 million yuan, and less than 400 second-tier enterprises with sales ranging from 10 million yuan to 100 million yuan. More than 30%, most companies' sales are less than 10 million yuan. This is a far cry from the average sales of 1 billion listed companies in Taiwan.
As of the end of January 2012, in addition to National Star Optoelectronics, Lehman Optoelectronics, Ruifeng Optoelectronics, Hongli Optoelectronics, Wanrun Technology, Jufei Optoelectronics, Changfang Semiconductor and other seven listed companies, on February 1, 2012, the Securities Regulatory Commission A total of 515 IPO applications will be announced, and at least nine LED companies are waiting in line for listing. According to statistics, there are currently 40-60 LED companies actively engaged in the reform of the shareholding system, including LED packaging companies. It is expected that there will be more LED companies impacting IPOs in 2012, and more than 20 LED industry stocks will be listed and traded at the end of the year. .
According to industry insiders, in view of the fierce competition in the domestic LED packaging industry in 2012, more manufacturers have chosen to increase their promotion efforts and expand their market share to avoid the staged dilemma caused by overcapacity.
In 2012, the pattern competition of the LED packaging industry will be launched between the first camp and the packaged listed companies. At present, some listed companies have quietly launched layout cooperation, who will rise and fall? It will appear in 2013.
Hot spot 2: Four major development trends of LED packaging technology in 2012
LED packaging technology is currently developing in four directions: high luminous efficiency, high reliability, high heat dissipation capability and thinness. The main highlights are: silicon-based LED, COB packaging technology, flip-chip LED chip package, high-voltage LED.
The reason why silicon-based LEDs are attracting more and more attention in the industry is that it is more powerful than traditional sapphire-based LEDs, so the power can be made even larger. Cree focuses on the development of silicon-based LEDs, which currently exist. The main problem is that the yield is still low, resulting in higher costs.
COB light source has relatively low production cost, obvious heat dissipation function, high packing density and high optical density, and is easy to be personalized. It is one of the leading directions for future packaging development.
The current problem is that COB reduces the light loss caused by multiple refractions of one optical lens, so it still needs to be improved in terms of light extraction efficiency and thermal energy increase, and the fabrication yield of the substrate needs to be improved.
The flip chip type LED chip package is one of the goals of the industry. The fabrication of flip chip is much simpler than stereo, and it can avoid complex processes, which greatly improves the feasibility of mass production. With the back-end chip process assist and the eutectic solid crystal method, the flip chip package is greatly simplified. The technology threshold, driven by energy saving and carbon reduction in the future, flip chip packaging will be a good solution.
The packaging of high voltage LEDs is also a major focus. The advent of high-voltage products is to solve the problem of excess energy consumption caused by the existence of step-down circuit in solid-state lighting with a new thinking, and then help end consumers to reduce the purchase cost, so that different regions can be operated under different voltage operating conditions. Get fast and convenient applications.
Hot spot 3: LED package product upgrade, the price is expected to be lowered step by step
In 2012, the competition for LED packaging products was mainly concentrated in the two main battlefields of LED backlighting and LED lighting. The mainstream LCD TV backlight specification LED components on the market in 2012 will be picked up by the new specification (7030). As for the lighting field, after the price of (5630) products has dropped to a certain extent, the proportion of applications in the LED lighting market will gradually increase in the future, and it is expected to be squeezed down to (3014) and (3020) LED package products in lighting. Market application.
A lot of normalization is a problem of wear and tear, and in turn helps end consumers reduce the cost of purchase. At present, TV backlight (5630) has dropped by about 4%. (7030) In the absence of mass production, the average quotation does not seem to be very competitive, but it is expected to fall sharply by the end of 2012 if it is mass-produced. The rise of notebook computer (NB) applications has resulted in a maximum drop of 8% for high-brightness 0.8tLEDs; the price of mobile phones has gradually declined from 5 to 6% due to the maturity of specifications; the high-power LED segment, manufacturers are committed to specification improvements and For the clearance of old products, the average price of the products has dropped by about 10%. As for the LCD backlight products, there are already brand manufacturers that introduce high-current driving 3014 packages, which can reduce the number of LEDs used by about half; because the backlight specifications (5630) tend to Mature, and the price drop has been large, making more and more lighting application manufacturers use (5630) to make LED tubes or bulbs. It is estimated that the first half of 2012 will drop by about 10%.
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